| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method by which a semiconductor substrate made into a thin sheet is peeled off with high reliability. SOLUTION: This peeling device adheres the semiconductor substrate to a holding substrate by thermoplastic resin, executes back surface processing, including making it into the thin sheet and then peels off the semiconductor substrate made into thin sheet from the holding substrate. The peeling device is provided with a pair of vacuum suction heads for performing suction respectively from the side of the holding substrate and from the side of the semiconductor substrate made into the thin sheet on the opposite surface, and at least one of the vacuum suction heads is provided with a moving mechanism for sucking and holding the semiconductor substrate, made into the thin sheet with the holding substrate at a prescribed position with the other vacuum suction head. Also, at least one of the vacuum suction heads is provided with a mechanism for moving in the single-opening direction for peeling, after the vacuum suction. In this peeling method, the device is used to make a start, and then peeling is performed. Thus, the semiconductor substrate made into thin sheet is peeled off with high reliability.</p> |
