| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer holder, with which a bump-forming surface is kept in a clean state and electroless plating is enabled, while preventing influence of ground effects. SOLUTION: This wafer holder 10 is provided with a wafer-mounting plate 11 and an upper lid member 12 for keeping mutual electrical insulation relation with a semiconductor wafer WF and the attaching/detaching parts 13. The wafer-mounting plate 11 is provided with a fitting recess part 111 of a depth larger than the thickness for one semiconductor wafer WF. The upper lid member 12 is provided with a pressurizing part 121 for a wafer peripheral edge part along the fitting recess part 111. For the upper lid member 12, the pressurizing part 121 is in brought into contact with the peripheral edge part of the semiconductor wafer WF, and the main surface area of the semiconductor wafer WF is made to be exposed. The attaching/detaching parts 13 are clamps made of stainless provided on four sides of the wafer-mounting plate 11, for instance and clamp and fix the upper lid member 12 from four sides.</p> |
