METHOD OF REMOVING PARTICLES ON SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To effectively remove fine particles adhered on the surface of a semiconductor wafer in a process for cleaning the wafer. SOLUTION: In a method of removing particles on a semiconductor wafer, the final process for rinsing the semiconductor wafer with ultrapure water or hydrogen water is executed after the wafer is cleaned with the mixed solution of H with F. In this final process, ultrasonic waves are irradiated into cleaning liquid after the passage of a prescribed time (preferably 20 to 30 seconds or longer).