发明名称 |
PLASMA TREATMENT APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To conduct plasma uniform treatment by reducing an impedance difference among a plurality of treatment chambers. SOLUTION: A connection between a conductor 7 of a holding section 3a and a conductor 7 of a holding section 3c makes a strip electrode 11 and a strip electrode 13 have equal electric potentials. In other words, the strip electrode 11 and the strip electrode 13 constitute a first electrode. A high frequency is applied to each strip electrode 11 and 11 from a single high frequency power supply 17 through a cable 18 and each strip electrode 13 and 13 are connected (shortened) by a strip conductor 19 having an approximately same width as that of the strip electrode 13. |
申请公布号 |
JP2002237487(A) |
申请公布日期 |
2002.08.23 |
申请号 |
JP20010033245 |
申请日期 |
2001.02.09 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
OBUCHI KAZUTO;MIZUTANI KAORU |
分类号 |
H05H1/46;B01J19/08;B01J19/24;H01J37/32;H01L21/302;H01L21/3065;H05H1/34 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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