发明名称 PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To conduct plasma uniform treatment by reducing an impedance difference among a plurality of treatment chambers. SOLUTION: A connection between a conductor 7 of a holding section 3a and a conductor 7 of a holding section 3c makes a strip electrode 11 and a strip electrode 13 have equal electric potentials. In other words, the strip electrode 11 and the strip electrode 13 constitute a first electrode. A high frequency is applied to each strip electrode 11 and 11 from a single high frequency power supply 17 through a cable 18 and each strip electrode 13 and 13 are connected (shortened) by a strip conductor 19 having an approximately same width as that of the strip electrode 13.
申请公布号 JP2002237487(A) 申请公布日期 2002.08.23
申请号 JP20010033245 申请日期 2001.02.09
申请人 TOKYO OHKA KOGYO CO LTD 发明人 OBUCHI KAZUTO;MIZUTANI KAORU
分类号 H05H1/46;B01J19/08;B01J19/24;H01J37/32;H01L21/302;H01L21/3065;H05H1/34 主分类号 H05H1/46
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