| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the conventional method of manufacturing a hybrid integrated circuit device requiring many assembling processes, since many circuit elements are fixed on a hybrid integrated circuit device which comprises a printed board, etc., mounted with circuit devices and a semiconductor element out of the circuit elements is wire-bonded, using a metal fine wire. SOLUTION: A semiconductor device to be used in the hybrid integrated circuit is, such that a semi-power transistor 13 is fixed on a heat sink 11 and is connected with an extraction electrode 12 provided adjacent to the semi-power transistor 13 via a metal fine wire 16 and then is molded with an insulation resin 17. The molded semiconductor device is fixed on a mount substrate formed with a conductor pattern. As a result of this method, the manufacturing process of the hybrid integrated circuit device can be simplified and the number of processes can be reduced. |
