| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC carrier with a plate-like frame body for preventing the IC carrier from being carelessly removed from the plate-like frame body by applying bending stress and torsional stress, and removable by simple operation when removing the IC carrier from the plate-like frame body. SOLUTION: This IC carrier with the plate-like frame body connects the plate-like frame body and the IC carrier having an IC module formed inside the plate-like frame body by a connecting part. The connecting part is formed on one side edge of the IC carrier. The connecting part is formed narrower than a width dimension of the IC carrier. A slit part is formed on the other peripheral edge forming no connecting part of the IC carrier. |
