发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize reduction of threshold voltage using a metal gate, without requiring complicated manufacturing steps. SOLUTION: A silicon oxide film 15 is formed as an insulation film on a silicon substrate 11, and a tungsten film is formed on the formed film 15 by a PVD method. Then, a PMOS region is covered with a photoresist 17, and thorium is introduced into the film 16 on the NMOS region through ion implantation. In this way, the metal gate of the PMOS is formed of a tungsten, and the metal gate of the NMOS is formed of a thorium-doped tungsten, and thus the metal gates having different work functions can be formed easily on the PMOS and the NMOS.
申请公布号 JP2002237589(A) 申请公布日期 2002.08.23
申请号 JP20010031927 申请日期 2001.02.08
申请人 SONY CORP 发明人 SUZUKI ATSUSHI
分类号 H01L21/28;H01L21/8238;H01L27/092;H01L29/78;(IPC1-7):H01L29/78;H01L21/823 主分类号 H01L21/28
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