发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which restrictions are not generated in the dimension of a semiconductor element to be mounted and in which a plurality of all types of semiconductor elements can be mounted. SOLUTION: A semiconductor device 219 or 222 is provided with a wiring board 216, in which a cavity 216a or an opening 216c is formed into a step shape and a plurality of internal semiconductor devices 211 mounted by using the difference of the step shape. |
申请公布号 |
JP2002237544(A) |
申请公布日期 |
2002.08.23 |
申请号 |
JP20010034265 |
申请日期 |
2001.02.09 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
MIZUNO SHIGERU;HORIUCHI MICHIO;KURIHARA TAKASHI |
分类号 |
H01L23/12;H01L23/50;H01L23/52;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|