发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device, in which restrictions are not generated in the dimension of a semiconductor element to be mounted and in which a plurality of all types of semiconductor elements can be mounted. SOLUTION: A semiconductor device 219 or 222 is provided with a wiring board 216, in which a cavity 216a or an opening 216c is formed into a step shape and a plurality of internal semiconductor devices 211 mounted by using the difference of the step shape.
申请公布号 JP2002237544(A) 申请公布日期 2002.08.23
申请号 JP20010034265 申请日期 2001.02.09
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MIZUNO SHIGERU;HORIUCHI MICHIO;KURIHARA TAKASHI
分类号 H01L23/12;H01L23/50;H01L23/52;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L23/12 主分类号 H01L23/12
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