| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component-mounting method for preventing the placement misalignment of electronic components with the changes in temperatures, and at the same time, for improving productivity, and to provide an electronic-component mounting machine. SOLUTION: In this electronic component-mounting method, the electronic component 5 is sucked, is positioned at a specific position on a circuit board 7, and is placed onto the circuit board 7. Also, in the electronic component- mounting method, aging operation is carried out automatically while the mounting is at rest, for eliminating the influence to mounting accuracy due to changes in the temperature. |
