发明名称 |
Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
摘要 |
To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.
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申请公布号 |
US2002115278(A1) |
申请公布日期 |
2002.08.22 |
申请号 |
US20020122317 |
申请日期 |
2002.04.16 |
申请人 |
KAWAI WAKAHIRO |
发明人 |
KAWAI WAKAHIRO |
分类号 |
H05K1/03;H01L21/56;H01L21/60;H01L21/607;H01L23/28;H05K1/09;H05K3/06;H05K3/32;(IPC1-7):H01L21/44 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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