| 摘要 |
In a cooling device for a heat source according to the present invention, header is arranged on the downstream side of an inlet port i.e. on the side of holes opposite to that of the heat source, a heat source is arranged on the outside face of a heat sink and holes are provided that spray fluid towards the back face of the heat sink, outlet ports being provided fewer than the number of holes. Thanks to the arrangement of header on the side of holes opposite to that of the heat source, no large differences are generated in the flow rate of the holes; thus, the heat conduction rate when the flow from holes collides with the back face of the heat sink is practically uniform and the cooling performance of the heat sink, with which the flow collides, at the back of the heat source is practically uniform.
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