| 摘要 |
PURPOSE: An electrostatic chuck is provided to perform a stable chucking process and to remarkably reduce process errors, by making a contact area of a wafer and a lower plate broader even if the wafer bowing is relatively small. CONSTITUTION: The electrostatic chuck includes the lower plate(101), a pad unit and a voltage applying unit(105). The pad unit is of a strip type, formed on the lower plate. The heights of adjacent strips are different. The voltage applying unit applies an electrostatic chuck(ESC) voltage to the lower plate. The vertical cross section of the strip is of a semicircle.
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