发明名称 |
Passive spray coolant pump |
摘要 |
A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.
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申请公布号 |
US2002113141(A1) |
申请公布日期 |
2002.08.22 |
申请号 |
US20010945046 |
申请日期 |
2001.08.31 |
申请人 |
MALONE CHRISTOPHER G.;BASH CULLEN E.;PATEL CHANDRAKANT D. |
发明人 |
MALONE CHRISTOPHER G.;BASH CULLEN E.;PATEL CHANDRAKANT D. |
分类号 |
H01L23/433;(IPC1-7):B05B9/00 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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