发明名称 Heatsink mounting with shock absorbers
摘要 Shock absorbers or other dampening mechanisms are added to an assembly including a heatsink, a semiconductor device, and a board, to reduce shock and/or vibration induced relative motion between the heatsink and the board.
申请公布号 US2002114137(A1) 申请公布日期 2002.08.22
申请号 US20010788128 申请日期 2001.02.16
申请人 PEARSON TOM E.;FARTASH ARJANG;COMBS CHRISTOPHER;ASPANDIAR RAIYOMAND F. 发明人 PEARSON TOM E.;FARTASH ARJANG;COMBS CHRISTOPHER;ASPANDIAR RAIYOMAND F.
分类号 H01L23/40;H05K7/20;(IPC1-7):H05K7/20;F28D15/00;H01B7/42 主分类号 H01L23/40
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