发明名称 Insulated gate type semiconductor device and method for fabricating the same
摘要 In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
申请公布号 US2002115257(A1) 申请公布日期 2002.08.22
申请号 US20020046077 申请日期 2002.01.16
申请人 HITACHI, LTD. 发明人 INAGAWA HIROSHI;MACHIDA NOBUO;OISHI KENTARO
分类号 H01L27/06;H01L21/331;H01L21/336;H01L21/8234;H01L27/04;H01L27/088;H01L29/06;H01L29/12;H01L29/417;H01L29/739;H01L29/78;(IPC1-7):H01L21/336;H01L29/94;H01L29/76;H01L21/476;H01L21/320;H01L31/119;H01L31/113;H01L31/062 主分类号 H01L27/06
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