发明名称 |
STABILIZED SLURRY COMPOSITIONS |
摘要 |
Provided are slurry compositions suitable for use in a chemical-mechanical planarization process and methods for making same. The compositions include: (a) abrasive particles dispersed in a suspension medium; (b) a peroxygen compound; and (c) a stabilizing agent. The stabilizing agent includes a phosphoric acid, a salt of a phosphoric acid or combinations thereof. The invention has particular applicability to the semiconductor manufacturing industry.
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申请公布号 |
WO0032713(A9) |
申请公布日期 |
2002.08.22 |
申请号 |
WO1999US28087 |
申请日期 |
1999.11.24 |
申请人 |
AIR LIQUIDE AMERICA CORPORATION;MISRA, ASHUTOSH |
发明人 |
MISRA, ASHUTOSH |
分类号 |
H01L21/304;C09K3/14;C23F3/00;H01L21/302;H01L21/321;(IPC1-7):C09K3/14;C09G1/02 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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