| 摘要 |
An electronic parts mounting board includes an electrode circuit base member having electrodes on at least one surface; projecting electrodes bonded to the electrodes of the electrode circuit base member; an insulating member provided on the electrode circuit base member in such a manner as to insulate the electrodes of the electrode circuit base member and the projecting electrodes; and circuit electrode patterns provided on the insulating member and the projecting electrodes. In this mounting board, the projecting electrodes are formed by forming specific projecting conductive members at specific positions of the circuit electrode patterns by plating, and pressing the projecting conductive members in the insulating member so as to pass through the insulating member and reach the electrodes of the electrode circuit base member. The mounting board is capable of connecting circuit electrode patterns to a specific electrode base member via small contacts comparable to those obtained by a photo via process at a high positional accuracy, and improving the flatness and adhesive force of the circuit electrode patterns, without use of an expensive laser system for drilling.
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