发明名称 WET ETCHABLE LAMINATED BODY, INSULATION FILM, AND ELECTRONIC CIRCUIT PART USING THE LAMINATED BODY AND THE FILM
摘要 <p>A laminated body having an insulation layer with such a property that dusting can be suppressed, an insulation film formed of the insulation layer, and an electronic circuit part formed of a patterned insulation layer; the laminated body, comprising a first inorganic substance layer, an insulation layer, and a second inorganic substance layer, or an inorganic substance layer and an insulation layer, the insulation layer further comprising two or more wet etchable insulation unit layers laminated on each other, wherein the irregularities on the surface of the inorganic substance layer is transferred onto the insulation layer in the interface between the inorganic substance layer and the insulation layer, and the averaged height of the irregularities transferred onto the insulation layer is less than the thickness of the outermost insulation unit layer of the insulation layer.</p>
申请公布号 WO2002064364(P1) 申请公布日期 2002.08.22
申请号 JP2002001381 申请日期 2002.02.18
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