Integrated semiconductor circuit

摘要

An integrated semiconductor circuit includes a semiconductor chip on which surface a plurality of connection electrodes are formed, a lower insulating layer covering the surface of the semiconductor chip such that the connection electrodes are exposed, a plurality of wiring portions formed on the lower insulating layer, each of the wiring portions being connected to the connection electrode at one end and provided with a component connection portion at the other end, an upper insulating layer covering the wiring portions such that the component connection portions are exposed, and an electronic component connected between different component connection portions.