Saw alignment technique for array device singulation

摘要

This method for aligning a slicing machine saw with saw streets of an array of units, such as a Multi-Chip Module printed circuit board, provides for initial alignment by reference to fiducial marks of the array. The alignment is refined by obtaining images of small portions of the array along the specific saw street to be cut, and analyzing the images to locate the features of the units adjoining each side of the saw street. The edges of the features adjoining the saw street are identified, and the saw is centered between the edges with a high degree of precision.