AMORPHOUS CARBON LAYER FOR IMPROVED ADHESION OF PHOTORESIST

摘要

An improved semiconductor device (10) including an amorphous carbon layer (14) for improved adhesion of photoresist and method of fabrication. The device includes a substrate (12) having a surface (13), a carbon layer (14), formed on the surface of the substrate, and a resist layer (16) formed on a surface of the carbon layer. The device is formed by providing a substrate having a surface, depositing a carbon layer on the surface of the substrate using plasma enhanced chemical vapor deposition (PECVD) or sputtering, and forming a resist layer on a surface of the carbon layer.