| 摘要 |
PURPOSE: To provide a bare chip carrier having high electrical and mechanical contact performance. CONSTITUTION: This bare chip carrier for holding a bare chip is provided with a bare chip carrier base part 1, a bump electrode 3 formed on the main surface of the bare chip carrier base 1 and connected to a pad electrode 21 of the bare chip 2, a bare chip carrier electrode 4 formed on the back of the bare chip carrier base part 1 and having a recessed part 41, and a wire 5 connecting the bump electrode 3 and the bare chip carrier electrode 4. |
