发明名称 |
Lötpaste |
摘要 |
In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process. <IMAGE> |
申请公布号 |
DE69431001(D1) |
申请公布日期 |
2002.08.22 |
申请号 |
DE1994631001 |
申请日期 |
1994.10.25 |
申请人 |
FUJITSU LTD., KAWASAKI |
发明人 |
SAKUYAMA, SEIKI;UCHIDA, HIROKI;WATANABE, ISAO |
分类号 |
B23K1/005;B23K1/08;B23K35/02;B23K35/36;H05B3/28;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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