| 摘要 |
<p>A laminate which comprises insulating polyimide resin layers and a metal foil and can be etched with an aqueous alkali solution. The laminate comprises a metal foil and formed thereon insulating polyimide resin layers. The insulating resin layers comprise at least one polyimide resin layer (A) having a coefficient of linear thermal expansion (CTE) of 30x10-6/°C or lower and at least one polyimide resin layer (B) having a glass transition temperature (Tg) of 300°C or lower. The layer in contact with the metal foil is the polyimide resin layer (B). The bonding strength between the metal foil and the layer (B) in contact therewith is 0.5 kN/m or higher. The insulating resin layers have an average rate of etching of 0.5 √m/min or higher when etched with 50 wt.% aqueous potassium hydroxide solution at 80°C. This laminate is useful for producing a flexible printed board, etc.</p> |
