| 摘要 |
<p>A first waveguide groove (34 )is formed in a sidewall of a main casing (30) housing a first circuit board (36), and a second waveguide groove (40) is formed in a sidewall of a sub-casing (32) hermetically housing a second circuit board (38) such that the first waveguide groove is in continuous connection with the second waveguide groove. Further, a lid (35) is attached to the sidewall of the main casing so as to cover the first and the second waveguide grooves, and a probe (42) provided on the second circuit board protrudes into the second waveguide groove. In addition, an inclined plane (34a) is formed at an end of the first waveguide groove so as to be in continuous connection with a through-hole provided in the lid. <IMAGE></p> |
