发明名称 |
HANDLER BLADE OF ROBOT FOR TRANSFERRING WAFER |
摘要 |
PURPOSE: A handler blade of a robot is provided to prevent a wafer drop or a broken wafer by normally correcting a deviated wafer mounted on the handler blade through a sliding along a slant surface. CONSTITUTION: A handler blade(30) of a robot comprises a fixing part(24) and a wafer mounting part(20) for mounting a wafer(22). At this point, the fixing part(24) has a slant surface having a defined slope at the connection portion between the fixing part(24) and the wafer mounting part(20). At this point, the slant surface of the fixing part(24) corrects a deviated wafer so as to stably mount at the wafer mounting part(20) through a sliding along the slope of the surface, thereby restraining a wafer drop or a broken wafer.
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申请公布号 |
KR20020066627(A) |
申请公布日期 |
2002.08.21 |
申请号 |
KR20010006907 |
申请日期 |
2001.02.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, JONG MO |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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