发明名称 |
Thermosetting resin composition and semiconductor device using the same |
摘要 |
A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device. |
申请公布号 |
EP1233446(A2) |
申请公布日期 |
2002.08.21 |
申请号 |
EP20020003138 |
申请日期 |
2002.02.14 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NORO, HIROSHI;FUSUMADA, MITSUAKI |
分类号 |
C08K5/10;C08F283/10;C08G59/18;C08K5/11;H01L21/56;H01L23/29 |
主分类号 |
C08K5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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