<p>The conventional communication device has a problem in that it is difficult to efficiently lower the temperature of a heat generating element mounted on a printed substrate and also to lower a surface temperature of a housing. The communication device of this invention is intended to solve the above discussed problem and is of a type including a communication circuit mounted on a printed substrate (2) and having a heat generating element (1); a shield casing (3) covering the communication circuit and shielding electromagnetic waves; a housing (4) for accommodating the shield casing (3) and the printed substrate (2); a heat diffusing member (5) mounted along an inner wall of the shield casing (3) for diffusing heat in a planar direction; and a heat insulating layer (6) disposed between the shield casing (3) and an inner wall of the housing (4). <IMAGE></p>
