WAFER EDGE EXPOSURE METHOD

摘要

PURPOSE: A wafer edge exposure method is provided to prevent photoresist residues at a wafer edge portion by continuously exposing the wafer edge portion without stopping at meeting points between a wafer flat zone and a wafer curve. CONSTITUTION: A photoresist deposited at an edge portion of a wafer(100) is entirely exposed by circulating the wafer(100) to a defined direction without stopping as the first exposure. At this time, the first exposure is started at a flat zone(110) by a light supplier. Then, the flat zone(110) is repeatedly exposed after the first exposure, because the photoresist deposited on the flat zone(110) is thicker than the photoresist deposited on the other zone of the wafer(100). Then, the photoresist deposited at the edge portion of the wafer(100) is removed by dipping the wafer(100) into a developing solution.