发明名称 THERMOPLASTIC POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE: A thermoplastic polyamide resin composition is provided to improve the heat resistance, the impact resistance, the resistance against drop weight impact and the mechanical strength and to reduce the molding shrinkage rate. CONSTITUTION: The thermoplastic polyamide resin composition comprises 50-90 wt% of a polyamide resin; 1-30 wt% of a modified aromatic vinyl-based compound/maleimide copolymer; 1-20 wt% of a thermoplastic elastomer; 0-20 wt% of an aromatic vinyl-based compound/maleimide/vinyl cyanide copolymer; and 0-20 wt% of an aromatic vinyl-based copolymer. Preferably the modified aromatic vinyl-based compound/maleimide copolymer comprises 30-80 wt% of an aromatic vinyl-based compound; 30-80 wt% of maleimide having the repeating unit represented by the formula 1; 0.1-10 wt% of an unsaturated dicarboxylic acid or unsaturated dicarboxylic anhydride; and 0-40 wt% of other vinyl compounds copolymerizable with the aromatic vinyl-based compound. In the formula 1, R1 and R2 are H, a halogen atom or an alkyl group, respectively; and R3 is H, an alkyl group, an aromatic group or an aryl group.
申请公布号 KR20020066822(A) 申请公布日期 2002.08.21
申请号 KR20010007242 申请日期 2001.02.14
申请人 RHODIAPOLYAMIDE CO., LTD. 发明人 PARK, YO HAN;YOO, YEONG CHUL
分类号 C08L77/00 主分类号 C08L77/00
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