发明名称 RESIN COMPOSITION FOR INJECTION MOLDING
摘要 PURPOSE: Provided is a resin composition for injection molding which has wood-like appearance and thus can be used as wood substitute, and which has the quality of plastics and improved injection moldability. CONSTITUTION: The resin composition comprises 10-50 wt% of polystyrene(GPPS), 5-45 wt% of butadiene-styrene(HIPS) resin, 1-60 wt% of ethylene-vinyl acetate copolymer resin, and 0.5-80 wt% of CaCO3. The polystyrene(GPPS) has molecular weight of 100,000-250,000. The butadiene-styrene(HIPS) resin comprises 10-40% of rubber having particle diameter of 1-5 micrometer. The ethylene-vinyl acetate copolymer resin comprises 1-30% of vinyl acetate, and has a specific gravity of 0.9-0.99 and a melt index of 0.2-30.
申请公布号 KR20020066774(A) 申请公布日期 2002.08.21
申请号 KR20010007121 申请日期 2001.02.13
申请人 KANG, JONG TAE;LEE, KYUNG SIK 发明人 KANG, JONG TAE;LEE, KYUNG SIK
分类号 C08L25/06;C08K3/26;C08L9/06;C08L27/06;C08L31/04 主分类号 C08L25/06
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