发明名称 |
RESIN COMPOSITION FOR INJECTION MOLDING |
摘要 |
PURPOSE: Provided is a resin composition for injection molding which has wood-like appearance and thus can be used as wood substitute, and which has the quality of plastics and improved injection moldability. CONSTITUTION: The resin composition comprises 10-50 wt% of polystyrene(GPPS), 5-45 wt% of butadiene-styrene(HIPS) resin, 1-60 wt% of ethylene-vinyl acetate copolymer resin, and 0.5-80 wt% of CaCO3. The polystyrene(GPPS) has molecular weight of 100,000-250,000. The butadiene-styrene(HIPS) resin comprises 10-40% of rubber having particle diameter of 1-5 micrometer. The ethylene-vinyl acetate copolymer resin comprises 1-30% of vinyl acetate, and has a specific gravity of 0.9-0.99 and a melt index of 0.2-30.
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申请公布号 |
KR20020066774(A) |
申请公布日期 |
2002.08.21 |
申请号 |
KR20010007121 |
申请日期 |
2001.02.13 |
申请人 |
KANG, JONG TAE;LEE, KYUNG SIK |
发明人 |
KANG, JONG TAE;LEE, KYUNG SIK |
分类号 |
C08L25/06;C08K3/26;C08L9/06;C08L27/06;C08L31/04 |
主分类号 |
C08L25/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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