METHOD FOR PLATING OF LEAD FRAME

摘要

PURPOSE: A lead frame plating method is provided to equally and excellently keep a plating quality by partially changing several solders into deionized metals. CONSTITUTION: An anode basket(18) including a number of solders(10) is located in a plating bath(16) filled with an electrolytic solution so as to perform a plating on a surface of an outer lead of a lead frame(14). A Pt plate(12) as a deionized metal is located instead of the anode basket(18) having a number of solders(10) at the opposite position against the anode basket(18) using the lead frame(14) as a datum. Then, the anode basket(18) and the Pt plate(12) are respectively connected with positive voltage sources and the lead frame(14) is connected with negative voltage sources, so that a plating of lead frame(14) is performed by freely controlling an ion concentration of the electrolytic solution.