发明名称 Layered dielectric on silicon carbide semiconductor structures
摘要 A dielectric structure is disclosed for silicon carbide-based semiconductor devices. In gated devices, the structure includes a layer of silicon carbide, a layer of silicon dioxide on the silicon carbide layer, a layer of another insulating material on the silicon dioxide layer, with the insulating material having a dielectric constant higher than the dielectric constant of silicon dioxide, and a gate contact to the insulating material. In other devices the dielectric structure forms an enhanced passivation layer or field insulator.
申请公布号 US6437371(B2) 申请公布日期 2002.08.20
申请号 US20010781732 申请日期 2001.02.12
申请人 CREE, INC. 发明人 LIPKIN LORI A.;PAIMOUR JOHN WILLIAMS
分类号 H01L29/749;H01L21/02;H01L21/04;H01L21/28;H01L21/314;H01L21/329;H01L21/336;H01L21/338;H01L21/822;H01L27/04;H01L29/06;H01L29/12;H01L29/161;H01L29/24;H01L29/40;H01L29/51;H01L29/739;H01L29/78;H01L29/812;H01L29/861;H01L29/94;(IPC1-7):H01L31/031;H01L29/76;H01L31/113;H01L31/062 主分类号 H01L29/749
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