发明名称 |
Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same |
摘要 |
A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.
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申请公布号 |
US6438281(B1) |
申请公布日期 |
2002.08.20 |
申请号 |
US20000539860 |
申请日期 |
2000.03.30 |
申请人 |
TOPPAN PRINTING CO., LTD. |
发明人 |
TSUKAMOTO TAKEHITO;KUMAI KOICHI;MINATO TAKAO;HIRAYAMA SHIGERU;ODE MASAYUKI |
分类号 |
H05K1/18;G02B6/138;G02B6/42;G02B6/43;H05K1/02;(IPC1-7):G02B6/12 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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