发明名称 |
Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device |
摘要 |
A wire bonding method comprising: disposing a plurality of leads (20) aligned in an imaginary plane (P) around the periphery of a semiconductor chip (10) having a plurality of electrodes (12) aligned on an imaginary straight line (L1); bonding wires (30) to the electrodes (12); bending the wires (30) toward the leads (20) as viewed from a direction perpendicular to the imaginary plane (P); and bonding the wires (30) to the leads (20).
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申请公布号 |
US6437453(B1) |
申请公布日期 |
2002.08.20 |
申请号 |
US20000646641 |
申请日期 |
2000.10.26 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KOYAMA YUGO;SAKURAI KAZUNORI |
分类号 |
H01L21/60;H01L21/607;H01L23/495;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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