发明名称 Method for joining an integrated circuit
摘要 A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a plurality of contact bumps formed integral to a surface area; and attaching the integrated circuit to the flexible circuit by fusing at least some of the contact bumps of the flexible circuit to at least some of the contact pads of the integrated circuit. The contact bumps have a shape which mitigates local stress buildup within the contact bumps after attachment of the contact bumps to the contact pads, so as to enhance the reliability of the electrical connection.
申请公布号 US6434817(B1) 申请公布日期 2002.08.20
申请号 US19990454789 申请日期 1999.12.03
申请人 DELPHI TECHNOLOGIES, INC. 发明人 FEIGENBAUM HAIM;SCHREIBER CHRIS M.;WANG ZHIPING;YEOW MENG TAN;CHUNG MAN TSUI CHRISTINA
分类号 H01L21/60;H01L21/56;H01L23/485;H05K1/18;H05K3/40;(IPC1-7):H05K3/34 主分类号 H01L21/60
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