发明名称 |
Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array |
摘要 |
A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable region and the dummy region of the substrate are electrically conductive and have a conductive portion. The method also includes the steps of forming a first insulating layer on the conductive portion, and forming a plurality of openings in the first insulating layer, the openings being arranged in a predetermined array pattern. Additionally, the method includes the step of performing one of electroplating and electrodeposition using the conductive portion as an electrode to form a first plated or electrodeposited layer in the openings and on the first insulating layer in both the usable region and the dummy region.
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申请公布号 |
US6436265(B1) |
申请公布日期 |
2002.08.20 |
申请号 |
US20000534341 |
申请日期 |
2000.03.24 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
SHIMADA YASUHIRO;YAGI TAKAYUKI;TESHIMA TAKAYUKI;USHIJIMA TAKASHI |
分类号 |
G02B1/00;G02B3/00;(IPC1-7):C25D5/02 |
主分类号 |
G02B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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