发明名称 TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a treating apparatus in which high precision treatment can be performed on the front and rear surfaces of a circular substrate at the same time in a single treating tank, the treating time can be shortened and the possibility to contaminate the circular substrate again can be lessened and which is made small in size as a whole. SOLUTION: This treating apparatus has a first substrate holding member, a second substrate holding member and at least one or more kinds of treating means for carrying out the prescribed treatment inside the treating tank. The first substrate holding member has a plurality of supporting shafts and rotating bodies which are arranged at the upper tips of the respective supporting shafts, on each of which an engagement part engaging with the outer peripheral edge part of the circular substrate is formed on the outer peripheral side and which are rotated integrally with the respective supporting shafts. The second substrate holding member has a rotating body, supporting shafts arranged radially on the rotating body and holding pawls which are arranged at the tips of the respective supporting shafts, on each of which an engagement part engaging with the outer peripheral edge part of the circular substrate is formed and which are rotated together with the respective supporting shafts while the prescribed positions of the treating tank are centered.
申请公布号 JP2002233832(A) 申请公布日期 2002.08.20
申请号 JP20010031730 申请日期 2001.02.08
申请人 SHIMADA PHYS & CHEM IND CO LTD 发明人 ABE YUSUKE;KITAGAWA KENICHI
分类号 B08B3/02;H01L21/304;(IPC1-7):B08B3/02 主分类号 B08B3/02
代理机构 代理人
主权项
地址