| 摘要 |
A method of producing a contact structure having contactors on a semiconductor substrate by a microfabrication technology for achieving an electrical connection with a contact target. The method includes the steps of: providing a substrate made of dielectric or semiconductor material; forming an interconnect trace on the substrate either by deposition or plating; applying microfabrication processes for forming a contactor having a base portion vertically formed on the interconnect trace, a horizontal portion whose one end is formed on the base portion and a contact portion vertically formed on another end of the horizontal portion, and attaching a sphere contact to a top end of the contact portion of the contactor.
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