发明名称 |
Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact |
摘要 |
A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling
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申请公布号 |
US6436735(B1) |
申请公布日期 |
2002.08.20 |
申请号 |
US20000630247 |
申请日期 |
2000.07.31 |
申请人 |
ALPINE MICROSYSTEMS, INC. |
发明人 |
GOETZ MARTIN P.;BROWN SAMMY K.;AVERY GEORGE E.;WIGGIN ANDREW K.;TODD TOM L.;BEAL SAM |
分类号 |
H01L21/66;H01L23/498;H01L25/065;H05K1/11;H05K1/14;H05K1/18;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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