| 摘要 |
A conductive paste which can form a thick film conductor containing no lead, being able to be fired at a middle temperature, superior in conductivity, and having sufficient adhesive strength to a substrate, and a printed wiring board formed using the conductive paste are provided. The conductive paste contains a Cu containing powder; a glass frit; and an organic vehicle, wherein the glass has a composition represented by xBi2O3-yB2O3-zSiO2, where x, y, and z are indicated in mole %, and a composition ratio (x, y, z) within the range surrounded by point A (15, 35, 50), point B (25, 60, 15), point C (45, 40, 15) and point D (45, 20, 35) in a ternary compositional diagram, and a mean particle diameter of about 0.1 to 1.0 mum.
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