Redundancy mapping in a multichip semiconductor package

摘要

A multichip semiconductor package provides redundancy mapping from one semiconductor chip to another. The semiconductor device can be salvaged, where normally it normally would be considered scrap. This is particularly important where multiple semiconductor chips are physically connected as a common unit. One multichip integrated circuit package has semiconductor chips integrally formed on a unitary substrate, and each semiconductor chip includes redundant circuitry adapted to selectively replace primary circuitry. Electrical interconnects couple the redundant circuitry from a one semiconductor chip to a second semiconductor chip.