| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device that can achieve high degree of planarity by reducing nonuniformity in the amount of polishing at the circumferential section of a wafer. SOLUTION: A top plate 6 is fixed onto the lower surface of a top block 5, and a guide ring 7 is fixed to the circumferential section. The wafer 1 is chucked onto the lower surface of the top plate 6 via a backing pad 8. A ring- like piston 11 is accommodated into a ring-like space section, formed between the top plate 6 and guide ring 7. A ring-like projection 11a is provided at the tip section of the piston 11 and passes through the clearance between the top plate 6 and guide ring 7. A ring-like backing pad 15 is bonded to the tip of the projection 11a. Pressure in a pressure chamber 12 is controlled to adjust the applied pressure by the piston 12, thus adjusting the contact pressure distribution between the wafer 1 and polishing cloth at the circumferential section. |
