发明名称 HEAT RADIATING DEVICE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide the heat radiating device of electronic components which sufficiently secures a space where heat is generated from electronic components and reduces the capacity and the weight of a heat-radiating member much more than a conventional one, while it has superior heat radiating effect, and in which an electronic unit body can be miniaturized and lightened. SOLUTION: Heat, generated from the electronic components can be radiated, even in the space where heat is not radiated in a conventional case, by simultaneously cooling a plurality of electronic components by one heat-radiating member. Thus, an electronic circuit of high heat radiation can be cooled and an electronic unit can be miniaturized and lengthened, by reducing the capacity and weight of the heat radiating member with the integration of the heat radiating member.
申请公布号 JP2002232172(A) 申请公布日期 2002.08.16
申请号 JP20010030570 申请日期 2001.02.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MOCHIDA TOKUICHI;KAWAKAMI KEIZO;INOUE HIROTO
分类号 H05K7/20;H01L23/36;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址