| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer board exhibiting superior high-frequency characteristics, mechanical strength, machinability, and the like. SOLUTION: Substrates 1, each having copper foil layers 3 formed on the opposite sides of a core layer 2, are hot pressed via a prepreg 4 to produce a wiring board. A resin constituting the prepreg 4 is principally made of polybutadiene. The copper foil layer 3 is blackened. The pealing strength between the copper foil layer 3 and the prepreg 4 is set at 0.3 kN/m or higher. |
