| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the thickness of a chemical applied to the surface of a substrate becoming nonuniform and the characteristics of an obtained electronic device varying or the manufacturing yield of the device deteriorating, because wafer chuck holding the rear surface region of the substrate, corresponding to the electronic device forming region of the substrate. SOLUTION: The rear-surface region of the substrate 1, corresponding to regions other than the electronic device forming region formed on the surface of the substrate 1 is held by means of suction sections 9a, 9b, and 9c. Consequently, the temperature in the electronic device forming region becomes uniform, when the chemical is applied, and accordingly, a chemical film having a fixed thickness can be formed. Therefore, the manufacturing yield and quality of the electronic device can be improved.
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