SUBSTRATE PROCESSOR AND SUBSTRATE-PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress outside air from infiltrating into a reaction chamber and a vapor phase from backflow, while the reaction chamber is opened to the outside via a substrate-inserting/ejecting opening. SOLUTION: A vertical CVD apparatus 200 has a second gas feed system 240 and a second bypass line 264. The gas feed system 240 feeds an inert gas in a space 3a, between an outer and inner tubes 1A, 2A of a reaction furnace 211 during loading and unloading of a boat. The bypass line 264 evacuates the atmosphere in a reaction chamber 1a, by a slow exhaust process during the loading and unloading of the boat.