COMPLEX PARTICLES FOR DIELECTRIC SUBSTANCE, DIELECTRIC SUBSTANCE FORMING COMPOSITION, AND ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To enable to form a dielectric layer with low dielectric loss tangent of 0.1 or less, and high dielectric constant of 30 or more, at low heating temperature of 500 deg.C or less. SOLUTION: The dielectric substance forming composition is able to form a dielectric substance with low dielectric loss tangent of 0.1 or less and high dielectric constant of 30 or more, at low heating temperature of 500 deg.C or less, which is composed of at least one resin component of either the complex particles for dielectric substance covered by conductive metal or its compound, or conductive organic compound or conductive inorganic material; or a polymerized compound and a polymer.