| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can reduce its mounting surface area and can obtain a wireless package small in size and thickness with a small loss and high efficiency. SOLUTION: A groove made in a dicing street is used to extend the anode electrode of a diode up to a side surface of the diode. Thereby an ineffective part between the diode and a lead can be reduced, thus realizing a miniaturized device. Further, the height of the diode can be suppressed and made small in thickness. Since a bonding wire is not used for connection, there can be provided a method for manufacturing a semiconductor device with a small loss and high efficiency. |
