| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer cleaning device and a wafer- cleaning method using the device. SOLUTION: The semiconductor wafer cleaning device comprises a chamber 100 where a wafer W is introduced, a rotatable chuck 102 that is positioned in the chamber 100 for supporting and fixing the wafer W, a nozzle 104 for jetting a cleaning liquid onto the wafer W, a lid body 106 for covering the upper portion of the chamber 100, a heating lamp 108 that is fixed at the upper section of the lid body 106 for heating the wafer W or the cleaning liquid, and a contamination preventing board 110, that is position at the lower portion of the heating lamp 108 in a cooling water conduit for covering the lid body 106 and the lid body 106 for preventing the heating lamp 108 from becoming contaminated with the cleaning liquid, thus heating cleaning liquids such as ozone water, hydrogen water, and electrolytic ion water for washing the wafer W, in a short time.
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